Its true that solder paste is metallic although solder paste alone is not a great connection. Another more obvious problem is that some of your components might not be soldered.Thermally shocked components may not function as expected until they are brought to regular conditions although sometimes they will flat-out break. While there have been measures taken to reduce this during the design of chips, it is still a problem if procedures aren't followed properly. If you heat up too quickly, you can thermally shock your components that are already placed on the board.This can be a pain to fix depending on where the component is. If your board contains large copper pours, and are not warmed up properly, during reflow, your components can tombstone which is when a resistor or something will literally stand up and then is soldered in place like that.If you don't follow the reflow profile properly, there are a few things that can happen So, again, what are my risks on not following the profile and is it worth combining the two techniques, or use exclusively one? Neither, I will be able staying close to the suggested profile. Regardless, whether using only the air gun, only the oven, or the combination of the two, I will definitely not be able to perform the task within 250 seconds as suggested by the profile. But how about the profile curve? The heating rates? I realize that the peak temperature must not exceed the maximum allowable temperature for components. Then, use the hot air gun to finish the job. What I plan to do is to get a cheap oven at the store and preheat the board to say 180-200C. I did not want to use oven, being afraid that I might overheat the components, whereas using a hot air gun would let me control local heating just to the melting temperature, simply by observing it. Also, it takes a long time to heat the board with the hot air gun. When doing my first assembly I noticed that if I got the lead partially melted and then slightly cooled down, it is more difficult to re-melt it again. So, I have a board about 9 inch^2 and a hot air gun and Kester solder paste. Would there be any risk going the approach I plan to take.What are the consequences of not following the recommended reflow profile.I found many questions about how to perform reflow soldering, but my main concern is
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